Provided: BGA chip repair, assembly, welding, BGA disassembly, degumming, BGA ball planting, braiding, CMOS chip mirror polishing, chip grinding, lettering, chip burning, QFN tin removal, IC foot repair.
Sales: BGA repair table, BGA ball planter, BGA tin ball, BGA solder paste, BGA solder paste, tin ball, heating table, BGA special oven