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Tin implantation on BGA chip

HI series BGA planting balls

Provided: BGA chip repair, assembly, welding, BGA disassembly, degumming, BGA ball planting, braiding, CMOS chip mirror polishing, chip grinding, lettering, chip burning, QFN tin removal, IC foot repair.

After processing, it can be directly mounted on the machine.

    Please submit your basic information, we will contact you as soon as possible!

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