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BGA rework station

Over 750 Functional Optical BGA Repair System











    The characteristics of 750 repair station are introduced.

    The machine uses touch screen man-machine interface, heating time, heating temperature, heating speed, cooling time, early alarm, vacuum time and so on are all set inside the touch screen. The operation is intuitive, simple and easy to use.

    This machine adopts Panasonic PLC imported from Japan and Dalian Technological Temperature Control Module to control independently. It displays three temperature curves and four independent temperature measurement interfaces at any time. It can make accurate temperature judgement for multiple points of the chip, thus ensuring the welding yield of the chip.

    Three temperature zones are heated independently, and each temperature zone can set heating temperature, heating time and heating slope independently. Six heating zones can simulate reflow welding heating mode and set [preheating, insulation, heating, welding, reflow, cooling] separately.

    The machine has the functions of automatic feeding, feeding and discharging, and can automatically identify the central position of the chip when aligning.

    Multi-functional mode selection, including four modes of welding, unloading, mounting and manual, can achieve automatic and semi-automatic functions, better meet the various needs of customers;

    The closed-loop control of high precision K-type thermocouple imported from the United States and the unique heating mode adopted by our company ensure that the welding temperature difference is within (+1 C).

    The machine adopts imported optical alignment system, equipped with 15-inch high-definition display, uses high-precision micrometer to adjust X/Y/R axis, and ensures alignment accuracy to be controlled in 0.01-0.02 mm.

    In order to ensure the accuracy of alignment, the upper heating head and mounting head are designed in an integrated way. The machine is equipped with BGA heating air nozzles of various specifications, which can better meet the needs of customers‘various chips. The heating air nozzles are easy to replace and can be customized for special requirements.

    Automation and high precision, completely avoiding human error; Lead-free process and the repair of double-layer BGA, QFN, QFP, capacitance and resistance components can achieve the best results.

    Side monitoring camera can observe the melting of tin ball, which is convenient to determine the curve and welding effect; (This function is an optional item).

    Introduction of Technical Parameters of 750 Repair Station:

    Total power: 6800W

    Upper heating power :1200W

    Lower heating power :1200W

    Infrared heating power of lower part :4200W (2400W controlled)

    Single Phase: AC 220V+1050Hz

    Positioning mode :optical lens + V-shaped slot + laser positioning lamp for fast positioning.

    Closed Loop with High Precision K-type Thermocouple for Temperature Control and Independent Temperature Measurement Up and Down

    Temperature accuracy can reach positive or negative 1 degree.

    High Sensitive Touch Screen+Temperature Control Module+PLC+Step Driver for Electrical Appliances Selection

    Maximum PCB size :500 x 450mm

    Minimum PCB Size: 10 x 10 mm

    The number of temperature measurement interfaces is 4

    Chip Amplification Ratio: 2-30

    PCB thickness: 0.5-8 mm

    Applicable chip :0.8mm-8cm

    Minimum chip spacing: 0.15mm

    Mounting maximum load: 500G

    Installation accuracy: (+0.01mm)

    Shape size :L670 *W780 *H850mm

    Optical alignment lens electric drive can move forward and backward to avoid absolute dead angle

    The net weight of the machine is about: 90 kg.

    Please submit your basic information, we will contact you as soon as possible!

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