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Glass BGA chip ball planting common bad phenomenon

Time:2013-07-09 Views:3162
玻璃类BGA芯片植球常见不良现象


1、多球



2、大小球



3、玻璃晶元裂损



4、球未熔到位



5、球连锡



6、芯片背面起泡



7、少球



8、掉焊盘



9、焊盘划伤



10、玻璃晶元角损



11、芯片本体边损



12、芯片球面起泡
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