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QFP plating

QFP Packaging Chip Disassembly, Tin Removal, Whole Foot, Forming, Packaging

    FLASH whole foot, pressing foot, plating, forming
    Provided: BGA chip repair, assembly, welding, BGA disassembly, degumming, BGA ball planting, braiding, CMOS chip mirror polishing, chip grinding, lettering, chip burning, QFN tin removal, IC foot repair.
    After processing, it can be directly mounted on the machine.
    Please submit your basic information, we will contact you as soon as possible!

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